| 摘要 |
This method is a production method for semiconductor devices obtained by sealing a semiconductor element, by using a sealing sheet. The production method for semiconductor devices comprises: a preparation step in which the sealing sheet and the semiconductor element are prepared; a sealing step in which, after the preparation step, the semiconductor element is sealed using the sealing sheet; and a recovery step in which, after the sealing step, the sealing sheet and the semiconductor element are recovered. The sealing step comprises an excess-portion generating step in which an excess portion of the sealing sheet is generated while the sealing sheet is being pressed by two press members arranged facing each other and sandwiching the sealing sheet therebetween. The recovery step comprises a removal step in which the excess portion is removed. |
