发明名称 |
ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE |
摘要 |
Disclosed is method of manufacturing an array substrate, including steps of: forming a thin film transistor on a substrate through a patterning process; and on the substrate on which the thin film transistor has been formed, forming an organic transparent insulation layer including a first via hole and a first transparent electrode layer disposed above the organic transparent insulation layer and including a second via hole through one patterning process, wherein the centers of the first via hole and the second via hole coincide with each other in a thickness direction of the substrate, and a projection of the first via hole on the substrate is within a projection of the second via hole on the substrate. |
申请公布号 |
US2015243681(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
US201414447961 |
申请日期 |
2014.07.31 |
申请人 |
BOE Technology Group Co., Ltd. |
发明人 |
Sung Um Yoon;Jin Choi-Seung |
分类号 |
H01L27/12 |
主分类号 |
H01L27/12 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing an array substrate, including steps of:
forming a thin film transistor on a substrate through a patterning process; and on the substrate on which the thin film transistor has been formed, forming an organic transparent insulation layer including a first via hole and a first transparent electrode layer disposed above the organic transparent insulation layer and including a second via hole through one patterning process, wherein the centers of the first via hole and the second via hole substantially coincide with each other in a thickness direction of the substrate, and a projection of the first via hole on the substrate is within a projection of the second via hole on the substrate. |
地址 |
Beijing CN |