| 发明名称 |
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE |
| 摘要 |
A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material. |
| 申请公布号 |
US2015243623(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414551070 |
申请日期 |
2014.11.23 |
| 申请人 |
Wang Zhijie;Bai Zhigang;Shu Aipeng;Xu Yanbo;Zhang Huchang;Zong Fei |
发明人 |
Wang Zhijie;Bai Zhigang;Shu Aipeng;Xu Yanbo;Zhang Huchang;Zong Fei |
| 分类号 |
H01L23/00;H01L23/29;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of assembling a semiconductor die grid array package, the method comprising:
providing a grid array assembly formed from an electrical insulating material with solder deposits embedded therein, wherein a first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material; mounting a semiconductor die to the first surface of the insulating material; electrically connecting electrodes of the semiconductor die to the solder deposits; and covering the semiconductor die and the first surface of the insulating material with an encapsulating material. |
| 地址 |
Tianjin CN |
