发明名称 |
AUTOMATED INLINE INSPECTION AND METROLOGY USING SHADOW-GRAM IMAGES |
摘要 |
Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed. |
申请公布号 |
US2015243018(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
US201514630252 |
申请日期 |
2015.02.24 |
申请人 |
KLA-TENCOR CORPORATION |
发明人 |
VAJARIA Himanshu;JAHANBIN Sina;RIES Bradley;MAHADEVAN Mohan |
分类号 |
G06T7/00;G06K9/46;G06K9/62;G01N21/95 |
主分类号 |
G06T7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A system comprising:
a light source configured to direct collimated light at an edge of a stacked wafer; a detector disposed opposite the light source, wherein the detector is configured to acquire a shadow-gram image of the edge of the stacked wafer; and a controller operatively connected to the detector, wherein the controller is configured to:
receive the shadow-gram image; andcompare characteristics of the shadow-gram image with predetermined measurements to inspect an edge profile of the stacked wafer. |
地址 |
Milpitas CA US |