| 发明名称 |
BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS |
| 摘要 |
A bottom package substrate is provided that includes a plurality of metal posts that electrically couple through a die-side redistribution layer to a plurality of die interconnects. The metal posts and the die interconnects are plated onto a seed layer on the bottom package substrate. |
| 申请公布号 |
WO2015126638(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
WO2015US14870 |
申请日期 |
2015.02.06 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
GU, SHIQUN;RADOJCIC, RATIBOR;KIM, DONG WOOK |
| 分类号 |
H01L21/48;H01L23/498;H01L25/10 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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