发明名称 WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME
摘要 Example embodiments relate to a wiring structure, a method of forming the same, and an electronic device employing the same. The wiring structure includes a first conductive material layer and a nanocrystalline graphene layer on the first conductive material layer in direct contact with the metal layer.
申请公布号 WO2015126139(A1) 申请公布日期 2015.08.27
申请号 WO2015KR01595 申请日期 2015.02.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, CHANGSEOK;SHIN, HYEONJIN;PARK, SEONGJUN;IM, DONGHYUN;PARK, HYUN;SHIN, KEUNWOOK;LEE, JONGMYEONG;LIM, HANJIN
分类号 H01L21/768;C01B31/04 主分类号 H01L21/768
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