| 摘要 |
In this manufacturing method for a multilayer substrate, first, a single-sided copper-clad substrate (18A) is prepared. Next, by performing extrusion from a conductive foil (12A) side thereof, a through-hole (141A) is formed in the conductive foil (12A) and in an insulating layer (11A), and the conductive foil (12A) is pushed into the inside of the through-hole (141A). Using a similar step, a single-sided copper-clad substrate (18B) is formed. Next, the single-sided copper-clad substrate (18A) on which the through-hole (141A) has been formed and the single-sided copper-clad substrate (18B) on which a through-hole (141B) has been formed are stacked. |
