METHOD FOR FORMING FILM LAYER AND SUBSTRATE INCLUDING THE FILM LAYER

摘要

The invention provides a method of forming a film layer and a substrate comprising the film layer, and belongs to the field of film fabricating technology. The invention can solve the problem that, by using the method of forming a film layer in the prior art, defective film layers is apt to occur. The inventive method of forming a film layer comprises forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple steps to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately. The inventive substrate comprises a film layer formed by the above method. The invention may be used for improving the quality of the film layer.

主权项

1. A method of forming a film layer, comprising:
forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple operations to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately.