SINTERABLE METAL PARTICLES AND THE USE THEREOF IN ELECTRONICS APPLICATIONS

摘要

Provided herein are sinterable metal particles and compositions containing same. Such compositions can be used in a variety of ways, i.e., by replacing solders as die attach materials. The resulting sintered compositions are useful as a replacement for solder in conventional semiconductor assembly, and provide enhanced thermal and electrical conductivity in high power devices. Thus, invention compositions provide an alternative to nano-particulate metals that must be subjected to mechanical force during cure.