发明名称 |
THERMALLY CONDUCTIVE PRE-APPLIED UNDERFILL FORMULATIONS AND USES THEREOF |
摘要 |
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive. |
申请公布号 |
WO2015127179(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
WO2015US16779 |
申请日期 |
2015.02.20 |
申请人 |
HENKEL IP & HOLDING GMBH;BAI, JIE;DO, LY;CHAU, HUNG;KIM, YOUNSANG;ECKENRODE, JULISSA |
发明人 |
BAI, JIE;DO, LY;CHAU, HUNG;KIM, YOUNSANG;ECKENRODE, JULISSA |
分类号 |
C09J5/00;C01B35/14;C01F7/02;C09J7/02;C09J9/00;C09J11/04;C09J133/08;C09J163/00;C09J175/04;C09J179/08;C09J183/04;H01L23/373 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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