GLUE CONTROL METHOD OF STEP PACKAGE SUBSTRATE

摘要

A glue control method of a step package substrate comprises: the first step, acid washing is conducted on an inner single chip of a package structure with a groove, and the groove is provided with a layer of peelable glue in a silk printing mode; the second step, the structure provided with the peelable glue in the silk printing mode is baked, so that the peelable glue is solidified and shaped; the third step, after the peelable glue is solidified and shaped, brown oxidation is conducted on the inner single chip, and lamination is conducted on the inner single chip so as to form a multilayer board; the fourth step, before a finished product is milled, the peelable glue is removed, so that the conductor under the peelable glue is exposed. The glue control method of the step package substrate can effectively prevent the situation that flow glue remains on the exposed conductor in the groove.