| 发明名称 |
PACKAGE ON PACKAGE THERMAL FORCING DEVICE |
| 摘要 |
Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC). |
| 申请公布号 |
US2015241478(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414186733 |
申请日期 |
2014.02.21 |
| 申请人 |
Sensata Technologies |
发明人 |
Davis Rick A.;Lopez Christopher |
| 分类号 |
G01R1/20;G01R1/04;G01R31/28;G01R1/067 |
主分类号 |
G01R1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal interposer comprising:
a test probe guide and insulator top; a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor; a test probe; and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC). |
| 地址 |
Attleboro MA US |
