发明名称 OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME
摘要 An optical communication module includes a circuit board, a photoelectric converting unit, and an optical coupler. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface, a hot-curable adhesive layer formed on the first surface, and a metal reflective layer formed on the second surface and aligned with the hot-curable adhesive layer. The photoelectric converting unit is mounted on the first surface. By virtue of the function of the metal reflective layer in the heat curing process, the optical coupler is precisely fixed to the substrate via the hot-curable adhesive layer.
申请公布号 US2015241269(A1) 申请公布日期 2015.08.27
申请号 US201514610194 申请日期 2015.01.30
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LAI CHIH-CHEN
分类号 G01J1/04;B32B38/00;B32B37/12;H05K3/30;B32B37/18 主分类号 G01J1/04
代理机构 代理人
主权项 1. An optical communications module comprising: a circuit board with a first substrate layer having a first surface and a second surface opposite, and substantially parallel to, the first surface, a hot-curable adhesive layer formed on a portion of the first layer surface, and a metal reflective layer formed on the second surface substantially opposite and aligned with the hot-curable layer; an optical coupler coupled to the first substrate surface; and a photo-electrical converting unit mounted on the first substrate layer; wherein, the hot-curable adhesive couples the optical coupler to the first substrate layer.
地址 New Taipei TW