SOLID-STATE TRANSDUCER DEVICES WITH OPTICALLY-TRANSMISSIVE CARRIER SUBSTRATES AND RELATED SYSTEMS, METHODS, AND DEVICES

摘要

Semiconductor device assemblies having solid-state transducer (SST) devices and associated semiconductor devices, systems, and are disclosed herein. In one embodiment, a method of forming a semiconductor device assembly includes forming a support substrate, a transfer structure, and a plurality semiconductor structures between the support substrate and the transfer structure. The method further includes removing the support substrate to expose an active surface of the individual semiconductor structures and a trench between the individual semiconductor structures. The semiconductor structures can be attached to a carrier substrate that is optically transmissive such that the active surface can emit and/or receive the light through the carrier substrate. The individual semiconductor structures can then be processed on the carrier substrate with the support substrate removed. in some embodiments, the individual semiconductor structures are simulated from the semiconductor device assembly and include a section of the carrier substrate attached to each of the individual semiconductor structures.

主权项

1. A semiconductor device assembly, comprising:
a plurality of semiconductor devices separated from one another by a trench, wherein individual semiconductor devices have a first side and a second side opposite the first side, and wherein the second side of the individual semiconductor devices is arranged to emit and/or receive light; a transfer structure attached to the first side of the individual semiconductor devices; and a carrier substrate attached to the second side of the individual semiconductor devices, wherein the carrier substrate is substantially optically transmissive such that the second surface can emit and/or receive the light through the carrier substrate.