发明名称 |
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) is inserted; a nonsticking determination circuit (36) configured to apply a predetermined electrical signal between a bonding target and the wire (30) in a clamped state and to determine whether or not the wire (30) and the bonding target is sticking as well as whether or not the wire (30) is disconnected based on a response of the application of the predetermined electrical signal; an annular projecting length detection ring (40) disposed coaxially with the capillary (28); and a projecting length determination circuit (38) configured to determine whether or not a projecting length of a wire tail projecting from the tip of the capillary (28) is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire (30) and the projecting length detection ring (40) as well as a presence of a discharge spark when a predetermined inspection high voltage is applied between the wire (30) and the projecting length detection ring (40). |
申请公布号 |
US2015243627(A1) |
申请公布日期 |
2015.08.27 |
申请号 |
US201514709761 |
申请日期 |
2015.05.12 |
申请人 |
Shinkawa Ltd. |
发明人 |
AKIYAMA Shinichi;SEKINE Naoki;NAKAZAWA Motoki |
分类号 |
H01L23/00;H01L21/66 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A wire bonding apparatus comprising:
a capillary through which a wire is inserted; an annular wire projecting length detection ring disposed coaxially with the capillary; and a projecting length determination unit configured to determine whether or not a projecting length of the wire projecting from a tip of the capillary is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire and the wire projecting length detection ring. |
地址 |
Tokyo JP |