APPARATUS AND PROCESS FOR WAFER CLEANING

摘要

A process and apparatus for cleaning a wafer, the wafer having a front side and a back side, are provided. The process begins with placing the wafer on a platform, and a first gas stream delivering in a direction from a center to an edge of the front side of the wafer. The first gas stream prevents liquid drops entering a work piece region on the front side of the wafer and protects the integrity of the integrated circuits. A cleaning brush is rinsed by a first liquid stream and contacting the edge of the wafer for cleaning the wafer. The cleaning brush scrubs unwanted residual materials from the edge of the wafer, and the first liquid stream flushes the cleaning brush to recover the cleaning ability.

主权项

1. A process for cleaning a wafer, the wafer having a front side and a back side, the process comprising:
placing the wafer on a platform; delivering a first gas stream in a direction from a center to an edge of the front side of the wafer; rinsing a cleaning brush; and contacting the edge of the wafer with the cleaning brush for cleaning the wafer.