| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals. |
| 申请公布号 |
US2015245487(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414480661 |
申请日期 |
2014.09.09 |
| 申请人 |
KIM Jin Gyu;KIM Jung Woo;KIM Tae Hun;CHOI Kyoung Sei |
发明人 |
KIM Jin Gyu;KIM Jung Woo;KIM Tae Hun;CHOI Kyoung Sei |
| 分类号 |
H05K1/14;H05K1/11;H05K1/18 |
主分类号 |
H05K1/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a plurality of first semiconductor chips mounted on a first region of a first surface of a first circuit board; a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board; and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals. |
| 地址 |
Asan-si KR |
