| 发明名称 |
PACKAGE SUPPORT, FABRICATION METHOD AND LED PACKAGE |
| 摘要 |
A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties. |
| 申请公布号 |
US2015243863(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201514606038 |
申请日期 |
2015.01.27 |
| 申请人 |
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
SHI JUN-PENG;CAI PEI-SONG;HUANG HAO;LIANG XING-HUA;LIN ZHEN-DUAN;CHAO CHIH-WEI;HSU CHEN-KE |
| 分类号 |
H01L33/62;C23F1/00 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package support comprising:
metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. |
| 地址 |
Xiamen CN |
