SUBSTRATE PROCESSING METHOD, PROGRAM, COMPUTER-READABLE STORAGE MEDIUM, AND SUBSTRATE PROCESSING SYSTEM

摘要

Provided is a substrate processing method in which a photolithography processing is performed on a wafer to form a resist pattern on the wafer. Ultraviolet ray is irradiated onto the resist pattern to cut side chains of the resist pattern to improve line edge roughness of the resist pattern. A processing agent is caused to enter the resist pattern and a metal is caused to be infiltrated into the resist pattern through the processing agent. Thereafter, the wafer is heated to vaporize the processing agent from the resist pattern to form a cured resist pattern.

主权项

1. A substrate processing method comprising:
a resist pattern forming process of forming a resist pattern on a substrate by performing a photolithography processing on the substrate; a side chain cutting process of cutting side chains of the resist pattern by irradiating energy ray on the resist pattern; and a metal processing process of causing a processing agent to enter the resist pattern in the side chains are cut, and causing a metal to be infiltrated into the resist pattern through the processing agent.