| 发明名称 |
Polymerized Film Forming Method and Film Forming Apparatus |
| 摘要 |
A polymerized film forming method for forming a polymerized film on a target surface of a target object by using a first raw material gas containing acid dianhydride and a second raw material gas containing diamine, the method comprising performing a surface treatment on the target surface by supplying a gas containing an adhesion promoting agent for enhancing adhesion between the target surface and the polymerized film, and supplying the first raw material gas and the second raw material gas to the surface-treated target surface to form the polymerized film, wherein when performing the surface treatment, at least one of the first raw material gas and the second raw material gas is supplied in addition to the gas containing the adhesion promoting agent. |
| 申请公布号 |
US2015240120(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201514625288 |
申请日期 |
2015.02.18 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
FUJIKAWA Makoto;YAMAGUCHI Tatsuya |
| 分类号 |
C09D179/08;C23C16/46;C23C16/52;C23C16/455;C23C16/44 |
主分类号 |
C09D179/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polymerized film forming method for forming a polymerized film on a target surface of a target object by using a first raw material gas containing acid dianhydride and a second raw material gas containing diamine, the method comprising:
performing a surface treatment on the target surface by supplying a gas containing an adhesion promoting agent for enhancing adhesion between the target surface and the polymerized film; and supplying the first raw material gas and the second raw material gas to the surface-treated target surface to form the polymerized film, wherein when performing the surface treatment, at least one of the first raw material gas and the second raw material gas is supplied in addition to the gas containing the adhesion promoting agent. |
| 地址 |
Tokyo JP |
