| 发明名称 |
MICROCHIP AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
There is provided a microchip including a plurality of substrate layers, and bonding layers provided at boundary surfaces between the substrate layers and configured to include a silicon compound. At least one of the bonding layers is configured to include an organic silicon compound. |
| 申请公布号 |
US2015239217(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201314408498 |
申请日期 |
2013.05.09 |
| 申请人 |
Sony Corporation |
发明人 |
Watanabe Hidetoshi;Segawa Yuji;Kato Yoshiaki |
| 分类号 |
B32B27/08;B32B3/30;B01L3/00;B32B37/12;B32B27/28 |
主分类号 |
B32B27/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microchip comprising:
a plurality of substrate layers; and bonding layers provided at boundary surfaces between the substrate layers and configured to include a silicon compound, wherein at least one of the bonding layers is configured to include an organic silicon compound. |
| 地址 |
Tokyo JP |
