SEMICONDUCTOR DIE PICKUP APPARATUS AND SEMICONDUCTOR DIE PICKUP METHOD

摘要

The present invention is provided with: a stage (20) including a suction surface (22) for sucking a dicing sheet (12); a suction opening (40) that is provided in the suction surface (22) of the stage (20); a cover (23) that opens/closes the suction opening (40) by sliding along the suction surface (22); and an opening pressure switching mechanism (80) that switches pressure of the suction opening (40) between a first pressure (P1) that is close to vacuum, and second pressure (P2) close to atmosphere. At the time of picking up a semiconductor die (15), each time the pressure of the suction opening (40) is switched to the second pressure (P2) from the first pressure (P1), the cover (23) is slid a predetermined distance in the opening direction. Consequently, generation of breakage of the semiconductor die is suppressed, and the semiconductor die is effectively picked up.