SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

摘要

A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

主权项

1. A semiconductor package, comprising:
a packaging substrate having a first surface with a plurality of bonding pads and a second surface opposite to the first surface; a plurality of passive elements disposed on the first surface of the packaging substrate; an adhesive film attached to the passive elements; a semiconductor chip attached to the adhesive film such that the adhesive film is sandwiched between the semiconductor chip and the passive elements; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; and an encapsulant formed on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires.