发明名称 LIQUID EJECTION HEAD, RECORDING APPARATUS AND HEAT RADIATION METHOD FOR LIQUID EJECTION HEAD
摘要 Provided is a liquid ejection head including: a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices; a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and a second support member that supports the first support member on a surface opposite to the main surface. A first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member.
申请公布号 US2015239238(A1) 申请公布日期 2015.08.27
申请号 US201514615960 申请日期 2015.02.06
申请人 CANON KABUSHIKI KAISHA 发明人 YAMADA Kazuhiro;Moriguchi Takuto;Tamenaga Zentaro;Iwanaga Shuzo;Moriya Takatsugu
分类号 B41J2/045;B41J2/14 主分类号 B41J2/045
代理机构 代理人
主权项 1. A liquid ejection head comprising: a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices; a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and a second support member that supports the first support member on a surface opposite to the main surface, wherein a first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member.
地址 Tokyo JP