| 摘要 |
A semiconductor module (2) is provided with high-potential wiring (300), output wiring (400), low-potential wiring (500), an upper arm switching element (110), an upper arm diode (120), a lower arm switching element (210), and a lower arm diode (220). The semiconductor module is formed such that the steady loss/switching loss ratio of the upper arm switching element (110) is less than the steady loss/switching loss ratio of the lower arm switching element (210). Furthermore, the semiconductor module is formed such that the steady loss/switching loss ratio of the upper arm diode (120) is less than the steady loss/switching loss ratio of the lower arm diode (220). |
