| 发明名称 |
LOW-PROFILE PACKAGE WITH PASSIVE DEVICE |
| 摘要 |
A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter. |
| 申请公布号 |
WO2015126640(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
WO2015US14895 |
申请日期 |
2015.02.06 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
VELEZ, MARIO FRANCISCO;KIM, DAEIK DANIEL;SONG, YOUNG KYU;ZHANG, XIAONAN;KIM, JONGHAE;YUN, CHANGHAN HOBIE;ZUO, CHENGJIE |
| 分类号 |
H01L23/13;H01F17/00;H01L23/498;H01L49/02 |
主分类号 |
H01L23/13 |
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