| 摘要 |
<p>Chemical vapor deposition equipment is provided. According to an embodiment of the present invention, the chemical vapor deposition equipment includes: a chamber; a susceptor provided inside the chamber; and a shadow frame placed on the susceptor to cover the outer circumference of the susceptor. The susceptor includes: a base end; and a support end protruding from the base end with a predetermined distance. The support end is placed on a reference plane part and on the outer circumference of the reference plane part and includes a cutting part recessed from the reference plane part.</p> |
