MULTIPLE DIE IN A FACE DOWN PACKAGE

摘要

A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

主权项

1. A microelectronic package, comprising:
(a) a subassembly including: a first substrate having oppositely-facing first and second surfaces and at least first and second apertures each extending between the first and second surfaces; a first microelectronic element having a front surface facing the first surface of the first substrate, the first microelectronic element having a plurality of first contacts at the front surface thereof aligned with the first aperture; first electrically conductive leads extending from the first substrate and bonded to the first contacts; and a second microelectronic element having a front surface facing the second surface of the first substrate and overlying at least a portion of the front surface of the first microelectronic element, the second microelectronic element having a plurality of second contacts at the front surface thereof aligned with the second aperture; second electrically conductive leads extending from the first substrate and bonded to the second contacts; and (b) a second substrate having a first surface facing the subassembly and a second surface opposed thereto, the second substrate having terminals configured for electrical interconnecting the microelectronic package with an external component; and (c) the subassembly being electrically interconnected with the second substrate.