发明名称 ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING CONNECTION BODY, AND CONNECTION METHOD
摘要 To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.
申请公布号 US2015243626(A1) 申请公布日期 2015.08.27
申请号 US201314428582 申请日期 2013.09.17
申请人 DEXERIALS CORPORATION 发明人 Sato Kouichi;Akutsu Yasushi
分类号 H01L23/00;B29C71/04;G02F1/1345;B32B33/00;C09J9/02;B29C59/02;B32B3/30 主分类号 H01L23/00
代理机构 代理人
主权项 1. An anisotropic conductive film, comprising: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and wherein, in the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.
地址 Tokyo JP