| 发明名称 |
PACKAGES WITH SOLDER BALL REVEALED THROUGH LASER |
| 摘要 |
An integrated circuit structure includes a substrate, a PPI over the substrate, a solder region over and electrically coupled to a portion of the PPI, and a molding compound molding a lower portion of the solder region therein. A top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and the maximum-diameter of the solder region is in the maximum-diameter plane. |
| 申请公布号 |
US2015243616(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414189701 |
申请日期 |
2014.02.25 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hu Yu-Hsiang;Chen Wei-Yu;Cheng Ming-Da;Kuo Hung-Jui;Liu Chung-Shi |
| 分类号 |
H01L23/00;H01L21/78 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit structure comprising:
a substrate; a Post-Passivation Interconnect (PPI) over the substrate; a first solder region over and electrically coupled to a portion of the PPI; and a molding compound molding a lower portion of the first solder region therein, wherein a top surface of the molding compound is level with or lower than a maximum-diameter plane, wherein the maximum-diameter plane is parallel to a major surface of the substrate, and wherein a maximum-diameter of the first solder region is in the maximum-diameter plane. |
| 地址 |
Hsin-Chu TW |
