发明名称 TREATMENT FOR ELECTROPLATING RACKS TO AVOID RACK METALLIZATION
摘要 An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.
申请公布号 WO2015126544(A1) 申请公布日期 2015.08.27
申请号 WO2015US11704 申请日期 2015.01.16
申请人 MACDERMID ACUMEN, INC. 发明人 HERDMAN, RODERICK, D.;CHAPANERI, ROSHAN, V.;HYSLOP, ALISON
分类号 C25D5/54;C25D5/56;C25D17/08 主分类号 C25D5/54
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