| 摘要 |
FIELD: process engineering.SUBSTANCE: invention relates to production of electronic hardware components. Proposed process comprises making of cermet or metal-glass base with mounting and contact metal islands, assembling and soldering of cermet base with case metal components, application of nickel and copper ply over nickel and their sintering in shielding or reducing gas medium to get a dense copper-nickel sublayer and application of gold on metal surfaces as a finishing coating.EFFECT: saving in gold, higher density of coating and rust resistance, better conductivity, higher efficiency and durability.4 cl |
