发明名称 MOLDED LEADFRAME FOR PCB-TO-PCB CONNECTION
摘要 A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.
申请公布号 US2015245501(A1) 申请公布日期 2015.08.27
申请号 US201414188855 申请日期 2014.02.25
申请人 Avago Technologies General IP (Singapore) Pte. Ltd 发明人 Schunk Nikolaus W.
分类号 H05K3/36;H01R43/24;H01R43/16 主分类号 H05K3/36
代理机构 代理人
主权项 1. A method for making an electrical connector, comprising: removing from a single metal sheet a unitary structure comprising a plurality of parallel substantially strip-shaped electrical conductors and at least one cross member interconnecting the plurality of electrical conductors; embedding an end portion of each electrical conductor of the structure in a mass of molding compound defining a leadframe body, a lead portion of each electrical conductor remaining exterior to the mass of molding compound; and separating the plurality of electrical conductors from each other by cutting the cross member while portions of each electrical conductor remain embedded in the molding compound.
地址 Singapore SG