PROCESS FOR MANUFACTURING CONDUCTIVE FILM AND PRINTED WIRING BOARD

摘要

The process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0 m/s or more, the laser power of the continuous-wave laser beam is 6.0 W or more, and the irradiation time per point on the surface of the precursor film is 1.0 μs or more.

主权项

1. A method for manufacturing a conductive film, comprising the steps of:
forming a precursor film containing particles of a metal oxide by applying a dispersion liquid containing the particles onto a substrate; and irradiating the precursor film with a continuous wave laser beam under relative scanning of the precursor film and the continuous wave laser beam, so as to reduce the metal oxide and thus form a metal-containing conductive film in a region irradiated with the continuous wave laser beam, wherein: the relative scanning is carried out at a speed not less than 1.0 m/s; the continuous wave laser beam has a laser power not less than 6.0 W; and the precursor film is irradiated at an irradiation time per spot on its surface of not less than 1.0 μs.