| 发明名称 |
LIGHT-EMITTING DIODE PACKAGE |
| 摘要 |
Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part. |
| 申请公布号 |
US2015243851(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201514695144 |
申请日期 |
2015.04.24 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
LEE Sangwoo;WON Sunghee |
| 分类号 |
H01L33/48;H01L33/62;H01L27/15;H01L33/50 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting device (LED) package, comprising:
a body including a cavity; a lead frame disposed in the cavity; and a light-emitting device electrically connected to the lead frame, the LED being inclined at a prescribed angle relative to a bottom surface of the cavity and including a light emitting part and a non-light emitting part, wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part. wherein the connection part is disposed on the side surface of the cavity. |
| 地址 |
Seoul KR |
