Wired Circuit Board and Producing Method Thereof

摘要

A wired circuit board (1) has a metal supporting board (2), a metal foil (3) formed on the metal supporting board (2), an insulating base layer (5) formed on the metal supporting board (2) to cover the metal foil (3), and a conductive pattern (7) formed on the insulating base layer (5) and a having a terminal portion (10). An opening (6) is formed in the insulating base layer (5) to expose the metal foil (3). An electrolytic plating layer (13) is formed on a surface of the terminal portion (10) by electrolytic plating, and it is therefore possible to determine whether or not the electrolytic plating layer (13) is formed on a surface of the metal foil (3) exposed from the opening (6) after forming the electrolytic plating layer (13) to inspect conduction between the metal foil and the conductive pattern (7).