发明名称 熱可塑性樹脂組成物に添加するのに用いるグラファイトフィルム粉砕物
摘要 PROBLEM TO BE SOLVED: To provide an inorganic substance-containing thermoplastic resin composition that is excellent in the thermal conductivity.SOLUTION: The high thermal conductivity thermoplastic resin composition contains at least thermoplastic resin and high thermal conductivity graphite of 500 W/mK or more in the surface direction thermal conductivity in the unit obtained by heat-treating the aromatic polyimide film that is produced by imidizing the polyamic acid that is a precursor by using the dehydrating agent and the imidization accelerator at the temperature of 2,500°C or more, and has at least the thermal conductivity of 5 W/mK or more. The aromatic polyimide film having the birefringence of 0.08 or more and the thickness of 100 μm or less is desirable for the raw material of the graphite and the high thermal conductivity graphite having the linear expansion coefficient of 0 ppm or less, the thickness of 50 μm or less, and the elastic modulus 1 GPa or more is desirable to be used.
申请公布号 JP5771172(B2) 申请公布日期 2015.08.26
申请号 JP20120210094 申请日期 2012.09.24
申请人 株式会社カネカ 发明人 松本 一昭;掛橋 泰;西川 泰司;若原 修平;太田 雄介;稲田 卓
分类号 C08K3/04;C01B31/04;C08G73/10;C08J5/18;C08L101/00;C09K5/14 主分类号 C08K3/04
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