发明名称 半導体装置
摘要 <p>PROBLEM TO BE SOLVED: To provide an art of enabling reduction in chip size of a semiconductor chip; and especially provide an art of enabling reduction in chip size of a semiconductor chip by shaping a layout arrangement in a short side direction in a rectangular-shaped semiconductor chip which composes an LCD driver.SOLUTION: A semiconductor chip CHP2 which composes an LCD driver comprises: input protective circuits 3a-3c arranged in a lower layer of part of a plurality of input bump electrodes IBMP; and SRAMs 2a-2c (internal circuits) arranged in the lower layer of the rest part of the plurality of input bump electrodes IBMP, where the input protective circuits 3a-3c are not arranged.</p>
申请公布号 JP5770875(B2) 申请公布日期 2015.08.26
申请号 JP20140052475 申请日期 2014.03.14
申请人 发明人
分类号 H01L21/822;H01L21/60;H01L21/82;H01L27/04 主分类号 H01L21/822
代理机构 代理人
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