| 摘要 |
<p>An electronic element mounting machine and an electronic element mounting method are provided. An electronic element can also be mounted even when a solder mark is difficult to identify. An electronic element (P) is mounted on a substrate (8) by the electronic element mounting machine (1). The substrate has a soldering pad part (800), a solder part (81), soldering pad marks (M1, M2) in the same coordinate system as the soldering pad part, and solder marks (m1, m2) in the same coordinate system as the solder part. The electronic element mounting machine can be switched between the solder mark mode where the electronic element is mounted on the substrate with the position of the solder marks as the reference, and the soldering pad mark mode where the electronic element is mounted on the substrate with the position of the soldering pad marks as the reference. When the position of the substrate is being determined, when no electronic element is mounted on the solder marks, the solder mark mode is executed. Under the circumstance of already mounting the electronic element on the solder marks, the soldering pad mark mode is executed.</p> |
