| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily and reliably bond film substrates of different kinds of materials without using lamination. <P>SOLUTION: The device 10 for lamination of the continuous film substrates includes: a first film substrate supply part 1A for supplying the first film substrate 1; a second film substrate supply part 2A for supplying the second film substrate 2; and a pair of clamping rollers 6, 7 for accumulating and clamping the first film substrate 1 and the second film substrate 2. A first electron beam irradiation device 3 and a second electron beam irradiation device 4 for applying electron beams to inner surfaces of the first film substrate 1 and the second film substrate 2 are provided at the upper stream side of the pair of clamping rollers 6, 7. The pair of clamping rollers 6, 7, the first electron beam irradiation device 3 and the second electron beam irradiation device 4 are surrounded by covers 15, 11, 12, respectively, inside of which is nitrogen atmosphere. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
