发明名称 |
FLOORING ASSEMBLY WITH HEAT DISSIPATION LAYER |
摘要 |
A flooring assembly (100) for a compartment floor includes a panel (104) made up of a first skin (126), a second skin (128) positioned below the first skin, and a core (120) encapsulated within the panel between the first and second skins and peripheral closeouts (124). A heat dissipation layer (116) is provided in the flooring assembly at or above the first skin. |
申请公布号 |
EP2909394(A2) |
申请公布日期 |
2015.08.26 |
申请号 |
EP20130753764 |
申请日期 |
2013.08.19 |
申请人 |
MILWAUKEE COMPOSITES, INC. |
发明人 |
DESING, JAMES, E.;BIDDLE, ANDREW, J. |
分类号 |
E04F15/10;B61D17/10;E04B1/94;E04C2/52 |
主分类号 |
E04F15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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