| 发明名称 |
POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<p>A polyimide precursor, at least 50 mol% of the structural units thereof being structural units that can be represented by general formula (1). In general formula (1), A represents a tetravalent organic group that can be represented by one of general formulas (2a) to (2c) and B represents a divalent organic group that can be represented by general formula (3).</p> |
| 申请公布号 |
KR20150097459(A) |
申请公布日期 |
2015.08.26 |
| 申请号 |
KR20157008796 |
申请日期 |
2013.12.19 |
| 申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. |
发明人 |
ENOMOTO TETSUYA;ONO KEISHI;OHE MASAYUKI;SUZUKI KEIKO;SOEJIMA KAZUYA;SUZUKI ETSUHARU |
| 分类号 |
C08G73/10;C08F290/14;C09D179/08;G03F7/027;G03F7/031;H01L21/02;H01L21/311 |
主分类号 |
C08G73/10 |
| 代理机构 |
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