Printed circuit board and method of manufacturing the same

摘要

A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.