| 摘要 |
<p>A method for the manufacture of a light emitting device is provided. The method comprises the steps of: providing a substrate (102) on which at least one light emitting diode (101) is arranged and; arranging a collimator (103), at least partly laterally surrounding said at least one light emitting diode, by bonding said collimator to said at least one light emitting diode and said substrate using a transmissive bonding material (104). By using the inventive method, the collimator can be arranged after the placement of the LED, which facilitates the placement of the LED.</p> |
