| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing method for suppressing collapse of a pattern, in a substrate having a metal film formed thereon. <P>SOLUTION: In a substrate processing method, rinse liquid containing water is provided to a substrate having a metal film formed thereon (S2). Thereafter, a first solvent not containing hydroxyl group is provided to the substrate, whereby the liquid retained on the substrate is replaced with the first solvent (S4, S5). Thereafter, a hydrophobing agent, for hydrophobing metal, containing a second solvent not containing hydroxyl group is provided to the substrate, whereby the liquid retained on the substrate is replaced with the hydrophobing agent (S6). <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
