| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooler which can enhance cooling capacity without compromising the reliability even when cooling a semiconductor chip generating a large amount of heat by using a cooling medium, and to provide a usage method of the cooler. <P>SOLUTION: The cooler has a heat receiving part 10 in which a hole 30 capable of passing a cooling medium 52 is formed. The material of the inner surface of the hole in the heat receiving part contains silicon, and a liquid showing reduction against the material of the inner surface of the hole in the heat receiving part is used as the cooling medium. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
