| 发明名称 |
Semiconductor device |
| 摘要 |
A semiconductor device includes an insulating substrate with a conductive pattern including an insulating substrate, a conductive pattern formed on a front surface of the insulating substrate, and a rear heat-sink formed on a back surface of the insulating substrate; a semiconductor chip joined on the conductive pattern through joining material, and leading terminals; and a mold resin exposing a surface of the rear heat-sink and end portions of the leading terminals, and sealing a front surface of the insulating substrate with the conductive pattern, a back surface of the insulating substrate with the conductive pattern, the semiconductor chip, the rear heat-sink excluding the exposed surface thereof, and the leading terminals excluding the end portions thereof. Each of side surfaces of the conductive pattern and the rear heat-sink is formed with a recessed groove, and the recessed grooves are filled with the mold resin. |
| 申请公布号 |
US9117795(B2) |
申请公布日期 |
2015.08.25 |
| 申请号 |
US201314364898 |
申请日期 |
2013.02.01 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
Nakamura Hideyo;Nashida Norihiro |
| 分类号 |
H01L23/34;H01L23/373;H01L23/433;H01L23/498;H01L25/07;H01L23/367;H01L23/00;H01L23/31 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
Kanesaka Manabu |
| 主权项 |
1. A semiconductor device comprising:
an insulating substrate, a conductive pattern formed on a front surface of the insulating substrate, and a rear heat-sink formed on a back surface of the insulating substrate; a semiconductor chip joined on the conductive pattern through joining material, and leading terminals; and a mold resin exposing a surface of the rear heat-sink and end portions of the leading terminals, and sealing a front surface of the insulating substrate, the conductive pattern, a back surface of the insulating substrate, the semiconductor chip, the rear heat-sink excluding the exposed surface thereof, and the leading terminals excluding the end portions thereof, wherein each of side surfaces of the conductive pattern and the rear heat-sink is formed with a bow-shaped groove, the bow-shaped groove including an insulating substrate side adjacent to the insulating substrate and another side opposite to the insulating substrate side, and having an inverse tapered shape with a smooth curved surface so that the insulating substrate side is located closer to a side end of the insulating substrate adjacent thereto than the another side, the bow-shaped groove having an acute angle at the insulating substrate side, and the bow-shaped grooves are filled with the mold resin. |
| 地址 |
Kawasaki-Shi JP |
