Electronic device and electronic device manufacturing method

摘要

An electronic device including: a substrate; a bank formed above the substrate; a semiconductor layer formed within an aperture surrounded by the bank; and electrodes electrically connected to the semiconductor layer. An outline of the aperture in plan view includes a first straight edge, a second straight edge continuous with one end of the first edge via a first connector, and a straight third edge continuous with the other end of the first edge via a second connector. The area of a first connector region differs from the area of a second connector region, the first connector region being defined by a first imaginary straight line along the first edge, a second imaginary straight line along the second edge, and the first connector, and the second connector region being defined by a third imaginary straight line along the third edge, the first imaginary straight line, and the second connector.

主权项

1. An electronic device comprising:
a substrate; a bank formed above the substrate; a semiconductor layer formed within an aperture surrounded by the bank; and a pair of electrodes electrically connected to the semiconductor layer, wherein an outline of the aperture in plan view includes a first edge that is a straight line segment, a second edge that is a straight line segment continuous with one end of the first edge via a first connector, and a third edge that is a straight line segment continuous with the other end of the first edge via a second connector, and the area of a first connector region differs from the area of a second connector region, the first connector region being defined by a first imaginary straight line extending along the first edge, a second imaginary straight line extending along the second edge, and the first connector, and the second connector region being defined by a third imaginary straight line extending along the third edge, the first imaginary straight line, and the second connector.