| 发明名称 | Electrostatic chuck assembly | ||
| 摘要 | Embodiments of electrostatic chucks for substrate processing are provided herein. In some embodiments, an electrostatic chuck may include a puck for supporting a substrate, the puck formed from a dielectric material and having a chucking electrode disposed within the puck proximate a support surface of the puck to electrostatically retain the substrate when disposed on the puck; a base having a ring extending from the base to support the puck; and a spacer disposed between the base and the puck to support the puck above the base such that a gap is formed between the puck and the base, wherein the spacer supports the puck proximate a peripheral edge of the puck. | ||
| 申请公布号 | US9117867(B2) | 申请公布日期 | 2015.08.25 |
| 申请号 | US201213536098 | 申请日期 | 2012.06.28 |
| 申请人 | APPLIED MATERIALS, INC. | 发明人 | Hwang Bernard L.;Marin Jose Antonio;Nguyen Son T. |
| 分类号 | H01L21/683;H01L21/687 | 主分类号 | H01L21/683 |
| 代理机构 | Moser Taboada | 代理人 | Moser Taboada ;Taboada Alan |
| 主权项 | 1. An electrostatic chuck, comprising: a puck to support a substrate, the puck formed from a dielectric material and having a chucking electrode disposed within the puck proximate a support surface of the puck to electrostatically retain the substrate when disposed on the puck; a base having a ring extending from the base to support the puck; and a spacer supported atop the ring of the base and disposed between the base and the puck to support the puck above the base such that a gap is formed between the puck and the base, wherein the spacer supports the puck proximate a peripheral edge of the puck. | ||
| 地址 | Santa Clara CA US | ||