| 发明名称 | Substrate pad structure | ||
| 摘要 | A structure comprises a first pad protruding over a top surface of a package substrate, wherein the first pad is of a first elongated shape, a second pad embedded in the package substrate, wherein the second pad is of a second elongated shape and a via coupled between the first pad and the second pad. | ||
| 申请公布号 | US9117825(B2) | 申请公布日期 | 2015.08.25 |
| 申请号 | US201213706466 | 申请日期 | 2012.12.06 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Liu Hao-Juin;Chuang Chita;Chuang Yao-Chun;Tseng Ming Hung;Chen Chen-Shien |
| 分类号 | H01L23/538;H01L23/00;H01L23/498 | 主分类号 | H01L23/538 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A structure comprising: a first pad protruding over a top surface of a package substrate, wherein the first pad is of a first elongated shape; a second pad embedded in the package substrate, wherein the second pad is of a second elongated shape, and wherein the first pad and the second pad are separated by a solder resistor layer; and a via coupled between the first pad and the second pad. | ||
| 地址 | Hsin-Chu TW | ||